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EPM7512B芯片解密

    公司是从原有的芯片解密研究所发展而来,在芯片解密业界26年的经验上,专业致力于各类疑难IC解密、芯片解密、单片机解密、芯片程序提取等技术服务,可针对简单疑难芯片提供最具信赖的解密服务。
    芯片开发一般有芯片硬件设计和软件协同设计等环节,其中芯片硬件设计流程如下:功能设计阶段;描述和行为级验证能设计完成后,可以依据功能将SOC划分为若干功能模块,并决定实现这些功能将要使用的IP核;逻辑综合;门级验证。
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EPM7512B  Features:
· High-performance 2.5-V CMOS EEPROM-based programmable logic
devices (PLDs) built on second-generation Multiple Array MatriX
(MAX®) architecture (see Table 1)
– Pin-compatible with the popular 5.0-V MAX 7000S and 3.3-V
MAX 7000A device families
– High-density PLDs ranging from 600 to 10,000 usable gates
– 3.5-ns pin-to-pin logic delays with counter frequencies in excess
of 303.0 MHz
·  Advanced 2.5-V in-system programmability (ISP)
– Programs through the built-in IEEE Std. 1149.1 Joint Test Action
Group (JTAG) interface with advanced pin-locking capability
– Enhanced ISP algorithm for faster programming
– ISP_Done bit to ensure complete programming
– Pull-up resistor on I/O pins during in-system programming
– ISP circuitry compliant with IEEE Std. 1532