EPM7512AE芯片破解成功

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下文介绍关于EPM7512AE芯片的主要特性供大家参考，有需要者请与我们联系。
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EPM7512AE  Features：
· High-performance 3.3-V EEPROM-based programmable logic
devices (PLDs) built on second-generation Multiple Array MatriX
(MAX®) architecture (see Table 1)
·  3.3-V in-system programmability (ISP) through the built-in
IEEE Std. 1149.1 Joint Test Action Group (JTAG) interface with
advanced pin-locking capability
– MAX 7000AE device in-system programmability (ISP) circuitry
compliant with IEEE Std. 1532
– EPM7128A and EPM7256A device ISP circuitry compatible with
IEEE Std. 1532
·  Built-in boundary-scan test (BST) circuitry compliant with
IEEE Std. 1149.1
·  Supports JEDEC Jam Standard Test and Programming Language
(STAPL) JESD-71
·  Enhanced ISP features
– Enhanced ISP algorithm for faster programming (excluding
EPM7128A and EPM7256A devices)
– ISP_Done bit to ensure complete programming (excluding
EPM7128A and EPM7256A devices)
– Pull-up resistor on I/O pins during in-system programming
·  Pin-compatible with the popular 5.0-V MAX 7000S devices
·  High-density PLDs ranging from 600 to 10,000 usable gates
·  Extended temperature range